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According to statistics from the International Semiconductor Industry Association (SEMI), global silicon wafer shipments in the second quarter reached 3.035 billion square inches, a record high in four quarters and an increase of 7.1% from the first quarter.

The PCB industry has entered the traditional peak season, and major manufacturers such as Taiding-KY and Taiwan Optoelectronics have joined the fundraising ranks. Taiding will handle a cash capital increase with an upper limit of 40,000 bonds in the fourth quarter, investing in HDI production expansion for the first time; Taiwan Optoelectronics will also submit applications for the issuance of two convertible corporate bonds (CB). PCB industry financing actions have reached a climax.

The Taiwan Institute of Research released the EPI Electricity Prosperity Index for June today. In June, the national industrial high-voltage and above electricity consumption increased by 1.82% compared with the same period last year. Benefiting from the continued strong demand from emerging applications such as artificial intelligence and high-efficiency computing, the semiconductor industry's electricity consumption hit a record high. A record high over the years, leading other terminal device-related industries to prosper and develop together. The country's industrial electricity consumption has grown steadily, and the overall industrial electricity boom signal has been rising yellow and red for two consecutive months.

European semiconductor giant Infineon announced that the first phase of construction of its new factory in Malaysia has officially started operations. Upon completion, the plant will become the world's largest and most competitive 8-inch silicon carbide (SiC) power semiconductor wafer fab. This high-efficiency 8-inch silicon carbide (SiC) power semiconductor wafer fab will further strengthen Infineon’s position as the global leader in power semiconductors. The first phase of the new plant, with an investment of 2 billion euros, will focus on the production of silicon carbide power semiconductors and cover the epitaxial process of gallium nitride (GaN).

Jim Hamajima, President of SEMI International Semiconductor Association Japan, said that the chip industry needs more international standards for back-end processes so that Intel and TSMC, including Intel and TSMC, can more effectively increase production capacity.

To seize the demand of the Association of Southeast Asian Nations (ASEAN), Japanese printed circuit board (PCB) major Meiko Electronics announced a business cooperation with Chinese PCB manufacturer Aoshicon Technology Co., Ltd. (ASK). Meiko will establish ASK's Singapore subsidiary The company makes the investment.