Bonding System Change Process LCM (COG, COF)

Plasma cleaning is a process that utilizes low-temperature plasma to clean and activate surfaces. It is widely used in various industries, including semiconductor manufacturing, electronics, medical devices, and more. In the context of bonding system change for LSM (Liquid Crystal on Silicon) and COF (Chip-on-Film) technologies, plasma cleaning plays a crucial role in ensuring successful bonding and optimal device performance.

Plasma Cleaner PC03/PC04

Creating Nano PC03/PC04 low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.

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Atmospheric Pressure Plasma SAP013

SAP013 was designed to remove any kind of organic pollutants in conductive surface with low temperature and low Static damage rate by specially nozzle design. And the particle pollutants was minimizing by using platinum electrode and alloy nozzle.

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Plasma Cleaner DPC06

Creating Nano PC06 low pressure plasma cleaner system can be used on all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.

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