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The Global Electronics Association recently released the report "Connecting the World: Global Electronics Trade in a Turbulent Era," finding that the scale of component trade has surpassed that of end products. Cross-border trade in components such as semiconductors, connectors, and batteries has exceeded US$2.5 trillion, exceeding the US$2 trillion for end electronic products like mobile phones and laptops.

As AI applications continue to expand, the PCB industry is gradually benefiting from the growing demand for high-end packaging and advanced materials. Prices of upstream fiberglass (T-glass) and specialty copper foil are starting to rise. Taiwanese PCB supply chain manufacturers, including Gold Image Electronics, Unimicron, Hi-Tech, and Precision Technology, are expected to benefit from this upgrade cycle. The upgrade of AI servers is particularly critical. According to analysts' estimates, the PCB output value of each AI server is expected to increase 5-7 times compared to traditional servers.

In order to lay out key silicon photonic technologies, the Ministry of Economic Affairs plans to invest NT$1 billion in four years. In addition to strengthening the design of optical chips and cooperating with the world's advanced silicon photonic process component library, it also provides a feedback mechanism through the photoelectric measurement laboratory to accelerate the product development of the industry. In the future, it plans to launch a pilot production line to provide high-end module manufacturers with a small amount of various trial production services.

A Chinese team has developed the world's first programmable, single-chip all-optical signal processing platform (AOSP), breaking the limitation of traditional silicon photonics that requires "optical-electrical-optical (O-E-O)" conversion, allowing data to maintain the state of optical signals from input to output, and moving towards a new high-speed computing architecture that does not require switches.

The artificial intelligence (AI) industry has been booming for two years, driving the market demand for advanced node processes. This is because with the growing development of large language models (LLM) and large reasoning models (LRM), there is also the large-scale deployment of AI reasoning in various applications.

E Ink, a major electronic paper manufacturer, has created innovative electronic paper applications and announced the use of Intel's Smart Base technology, Innovation Platform Framework (Intel IPF) ecosystem and AI Assistant Builder to launch a new laptop electronic paper touchpad solution, which can create a low-power touch display interface for AI PCs and enhance user experience value.