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According to the latest research from global market research firm TrendForce, AI innovation is bringing about structural changes in the market. Data access volume continues to expand, relying not only on high-bandwidth, high-capacity, and low-latency DRAM products to support large-scale model parameter access, long-sequence inference, and multi-tasking parallel operation, but also on NAND Flash, a key component for high-speed data flow. Therefore, memory has become an indispensable key resource in AI infrastructure and a fiercely contested area for CSPs (Computer-Supplied Components).

Following the memory supercycle, PCBs and CCLs have also become the focus of market attention. A recent Goldman Sachs report points out that with the accelerated expansion of AI infrastructure, the demand for "higher speed" and "larger scale" in AI servers is driving these two industries into a "supercycle," and predicts that the PCB and CCL markets will grow by 113% and 142% respectively in 2026.

The 2025 revenue figures for all listed companies have been released, with verification and analysis companies showing outstanding performance. Companies including Pan-Chuan, iST, and HONGKANG all achieved new highs. Looking ahead, analysts indicate that with continued strong demand for AI, ASIC, and HPC, major wafer foundries continue to expand their investment in advanced processes. Coupled with the gradually unfolding opportunities in silicon photonics, related companies have good order visibility for 2026, and their full-year revenue has the potential to grow compared to 2025, reaching new highs.

Demand for Artificial Intelligence (AI) and High-Performance Computing (HPC) chips remains strong this year, leading to a supply shortage of CoWoS advanced packaging. Market assessments indicate that TSMC is continuing to expand its CoWoS capacity in Taiwan. Taiwanese packaging and testing companies, including ASE Technology Holding and King Yuan Electronics, are actively vying for advanced testing capabilities, while companies like Ingenic Semiconductor, Precision Test Systems, and Win Semiconductor are accelerating the expansion of testing interfaces required for AI chips.

According to a preliminary report by Gartner, global semiconductor revenue reached $793 billion in 2025, a year-on-year increase of 21%, primarily driven by demand for artificial intelligence (AI). The report indicates that AI semiconductors, including processors, high-bandwidth memory, and network components, continue to drive unprecedented growth in the semiconductor market, with related product sales approaching one-third of the overall market.

Humanoid robots have recently become a hot topic again. Research institutions point out that motion systems account for the largest PCB usage. Institutional investors are optimistic that companies already positioning themselves in this field include PCB leader Zhen Ding Technology Holding (4958), IC substrate leader Unimicron (3037), HDI leader Compeq (2313), veteran PCB manufacturer WUS (2316), and High-Tek PCB (5439), among others.