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China-based Lens Technology plans to collaborate with Intel on glass core substrates for advanced packaging. BOE is also aggressively developing complete production lines for glass carrier and glass core substrate packaging. In response to intensifying competition, Taiwan’s supply chain is integrating key processes across the semiconductor, optoelectronics, and equipment sectors to accelerate mass production.

Amkor Technology (AMKR.O), opens new tab said on Thursday it had entered a multi-year agreement with ​Nvidia (NVDA.O), opens new tab worth $1.5 billion to expand advanced semiconductor ‌packaging and test capacity in the U.S., as the chip industry races to build out ​AI infrastructure.

Market research firm TechInsights recently released its 2026 Global Advanced Packaging Outlook Report. The report identifies the second half of 2026 as a critical period for co-packaged optics (CPO) to achieve mainstream commercialization.

Japan’s Sumitomo Bakelite has developed a solid epoxy resin encapsulation material, the EME-G785 series, for next-generation silicon carbide（SiC）power modules, and has officially begun mass production. This material achieves an industry-first high glass transition temperature（Tg）of 230°C, meeting the stringent requirements for power semiconductor encapsulation materials used in high-temperature operating environments. Although SiC semiconductors can operate at temperatures above 200°C, the encapsulation materials used to protect semiconductor components still face challenges in heat resistance, making this a key issue in the development of next-generation power modules.

In 2026, the global energy landscape is undergoing its most profound paradigm shift since Edison invented the electric grid: Energy Autonomy.

At the 2026 Computex themed pavilion hosted by the Taiwan Advanced Automotive Technology Development Association (TADA), three companies with very different positions appeared side by side: Hui Jia Health, which focuses on fiber-optic physiological sensing; Japanese startup Lotus Thermal Solution, which specializes in porous metal thermal materials; and System Electronics, which began in automotive electronics and has since moved toward system integration.