2025/11/28 AI demand remains strong, and semiconductor packaging and testing plants are accelerating their expansion. The AI trend has been going on for several years, and there are still no signs of demand cooling down. Not only is TSMC continuing to expand its CoWoS capacity, but domestic packaging and testing companies are also increasing their investment in building new plants to seize business opportunities. Currently, companies including ASE Technology Holding, Powertech Technology, King Yuan Electronics, and Siliconware Precision Industries all have plans to expand their new plants and are accelerating their efforts to get them operational as soon as possible to capitalize on growth opportunities after 2026.
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