IC Packaging or LED Packaging

Plasma cleaners play a crucial role in the IC (Integrated Circuit) packaging and LED (Light Emitting Diode) packaging processes. These cleaners help ensure the cleanliness and quality of the components, which is essential for their functionality and reliability.

Benefits of Plasma Cleaners in IC and LED Packaging:

Efficient and selective cleaning without damaging sensitive components.
Enhanced adhesion and bonding between various materials.
Improved reliability and performance of packaged ICs and LEDs.
Prevention of defects caused by contaminants and residues.
Faster and more precise cleaning compared to traditional methods.

(1) Process before Die Attachment
(2) Process before Molding
(3) Process before Wire Bonding

Atmospheric Pressure Plasma SAP009SA

Spot type AP plasma, SAP009, was designed for low power (up to 120W) application with energy saving purpose. We combine plasma generator and plasma head to become a compact plasma tool. Combine with XY table it become a simple, low cost, AP plasma machine.

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Sputter coating System

Plasma processing system, such as surface treatment and surface modification

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Atmospheric Pressure Plasma SAP006

Creating Nano SAP006 Atmospheric Pressure Plasma (AP Plasma) was designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. SAP006 AP plasma treatment system’s unique design features and certified R&D patterns will tremendously increase surface bonding under normal operating conditions to produce ecofriendly products without compromising the reusability of materials. Our mission and value proposition is to create an error-free production environment to increase the overall benefits & profits of our clients.

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Plasma Cleaner DPC06

Creating Nano PC06 low pressure plasma cleaner system can be used on all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.

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