Touch Taiwan 2025 will be launched next week, with e-paper and panel-level packaging becoming highlights
TechNews
April 8, 2025
Author: Chen Guanrong
April 8, 2025
Author: Chen Guanrong
The annual technology event Touch Taiwan 2025 series of exhibitions will be held at the Nangang Exhibition Center from April 16 to 18, linking the Smart Display Exhibition, Smart Manufacturing Exhibition and Electronic Manufacturing Equipment Exhibition, and bringing together 10 countries including Japan, the United States, and France, as well as 328 benchmark manufacturers to participate.
At the call of E Ink Technology, Touch Taiwan 2025 has created the "E-Paper Zone" for the first time, bringing together 39 manufacturers from the upstream, midstream and downstream supply chains of the global e-paper industry, including TFT backplanes, e-paper modules, retail system integration, large-size signage integration, IC design, etc., to exhibit the latest technologies and applications and bring low-carbon and energy-saving e-paper solutions. The "E-Paper Zone" will become an important platform for exchanges and cooperation in the global e-paper industry chain.
The ePaper Industry Alliance (EPIA) and the Taiwan Display Union Association (TDUA) jointly held the "2025 ePaper Industry Ecosystem Development Forum" on the second day of the exhibition. Nearly 20 sessions discussed in depth the latest developments and strategic layout of the global ePaper industry, large, medium and small ePaper applications, TFT backplane technology for ePaper applications, and IC design solutions, comprehensively analyzing market trends, opportunities and challenges.
Touch Taiwan 2025 has added a new "PLP Panel Level Packaging Zone" for the first time in the Electronic Manufacturing Equipment Exhibition, focusing on advanced packaging panel level packaging (Panel Level Packaging). The exhibition projects include etching/laser/electroplating equipment, equipment system integration, redistribution technology, cutting machines, redistribution layer (RDL) equipment, wet process equipment, temporary bonding machines, dispensing equipment, chip picking/chip bonding equipment, TGV/glass substrates, PLP transport boxes and handling equipment, etc., and attracted many manufacturers to exhibit and jointly promote Taiwan's electronic equipment and advanced packaging technology to the international stage.
The "PLP Panel Level Packaging Forum" attracted AI application giants, semiconductor and packaging giants, and panel and IC substrate related manufacturers to participate in the event, sharing the latest solutions for the development trends and potential of the global market, TGV technology, substrate materials and manufacturing technology, metallization key technology, handling technology, etc., to enhance Taiwan's global competitiveness in the semiconductor and electronic equipment fields.
Moreover, as Micro LED technology matures, the implementation of innovative technologies has been accelerated in recent years, from panels, materials to equipment, which has promoted the mass production investment of the entire industry chain in Taiwan, making Taiwan an important base for the global Micro LED industry and building a complete supply chain ecosystem. Touch Taiwan 2025 will see more Micro LED application products and solutions such as high-end TVs, automotive displays and AR devices. There is also an "International Micro/Mini LED Display Summit Forum" that invites leading domestic and foreign manufacturers to share Micro LED's technological breakthroughs in mass production and future innovative product applications.
Related link: https://technews.tw/2025/04/08/2025-touch-taiwan-exhibitions-pre-show-press-conference-2/
Image source: Technology News, the picture shows Ke Furen, Chairman of the Taiwan Display Industry Association and CEO and General Manager of AU Optronics
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