Surface cleaning, activation, and modification for various substrates

Creating Nano PC03/PC04 low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.

High-Efficiency Continuous Processing, Setting a New Standard for Clean Manufacturing Specifically designed for pre-treatment of various substrates before printing and bonding, featuring surface activation, modification, grafting, roughening, and deep cleaning. Suitable for surface preparation of electronic and optoelectronic components prior to packaging and lamination, effectively improving process yield and reliability.

Spot type AP plasma, SAP013T/013X, was designed by tubular electrodes which can operate in higher power (up to 1100W) with Reasonable parts lifetime. High power output improves plasma processing efficiency and reduces processing time.

Spot type AP plasma, SAP009, was designed for low power (up to 120W) application with energy saving purpose. We combine plasma generator and plasma head to become a compact plasma tool. Combine with XY table it become a simple, low cost, AP plasma machine.