TPCA Show debuts, focusing on the three main axes of PCB
Commercial Times
October 18, 2025
By Li Juanping, Commercial Times
October 18, 2025
By Li Juanping, Commercial Times
The 26th Taiwan Printed Circuit Industry Exhibition and Conference (TPCA Show 2025) took place at the Taipei Nangang Exhibition Center from October 22nd to 24th. With AI, high-speed computing, and 5G applications driving industry momentum, Taiwan's PCB industry is expected to reach NT$915.7 billion in annual output value by 2025, a 12.1% year-over-year increase, demonstrating strong growth potential.
This year's TPCA Show, themed "Energy Efficient AI: From Cloud to the Edge," focused on the technical challenges and new opportunities of extending artificial intelligence (AI) applications from cloud data centers to edge computing, showcasing the innovative momentum driving the electronics industry into the energy-efficient AI era.
This year's exhibition features prominent industry and academic figures, including Unimicron Chairman Tseng Tsz-chang, Quanta Computer Executive Vice President Yang Qiling, Formosa Optoelectronics Chairman Tung Ting-yu, Zhen Ding Technology Chairman Shen Qing-fang, ASE Group CEO Wu Tianyu, and Tsinghua University Morris Chang Chair Professor Shi Qintai. These prominent figures will discuss the strategic layout and future opportunities of the PCB industry in the AI era.
According to TPCA statistics, Taiwan's PCB manufacturing output value reached NT$218.2 billion in the second quarter of 2025, a year-on-year increase of 14.4%, and reached NT$423.6 billion in the first half of the year, a year-on-year increase of 13.8%.
Continued strong demand for AI servers, high-speed computing, and communications is driving the industry's "off-season" performance, with full-year output expected to reach NT$915.7 billion, a record high.
Analysts predict that AI, high-speed computing, and 5G applications will be the three main drivers of PCB industry growth. The exhibition will focus on technological upgrades in copper-clad laminates (CCLs) and key upstream raw materials—copper foil, fiberglass cloth, and resin.
As AI servers move towards 224G and 400G high-speed interconnects, materials must simultaneously meet low loss, low dielectric constant (Low-Dk), low dissipation factor (Low-Df), and high heat resistance to support high-speed and high-power computing environments.
Related link: https://www.ctee.com.tw/news/20251018700139-439901
【Disclaimer】
The content of this article only represents the author's personal views and has nothing to do with Creating.
The content, text description and originality have not been verified by this site. This site does not make any guarantee or commitment to this article and all or part of the content, authenticity, completeness, and timeliness. It is for readers' reference only. Please verify the relevant content yourself.
The content of this article only represents the author's personal views and has nothing to do with Creating.
The content, text description and originality have not been verified by this site. This site does not make any guarantee or commitment to this article and all or part of the content, authenticity, completeness, and timeliness. It is for readers' reference only. Please verify the relevant content yourself.
Creating Nano Technologies, Inc.
59 Alley 21 Lane 279, Chung Cheng Road, Yung Kang City, Tainan, TAIWAN
TEL:886-6-2323927 FAX:886-6-2013306 URL: http://www.creating-nanotech.com
59 Alley 21 Lane 279, Chung Cheng Road, Yung Kang City, Tainan, TAIWAN
TEL:886-6-2323927 FAX:886-6-2013306 URL: http://www.creating-nanotech.com