Silicon photonics and 2nm technology drive continued revenue growth for verification and analysis plants this year.

2026/01/23

TechNews Report

January 19, 2026

Author: MoneyDJ

The 2025 revenue figures for all listed companies have been released, with verification and analysis companies showing outstanding performance. Companies including Pan-Chuan, iST, and HONGKANG all achieved new highs. Looking ahead, analysts indicate that with continued strong demand for AI, ASIC, and HPC, major wafer foundries continue to expand their investment in advanced processes. Coupled with the gradually unfolding opportunities in silicon photonics, related companies have good order visibility for 2026, and their full-year revenue has the potential to grow compared to 2025, reaching new highs.

As the AI chip market experiences explosive growth, the trend of major CSPs investing in ASICs is becoming increasingly clear, and they are accelerating the development of their own ASICs, launching a new generation of products on average every 1 to 2 years. With the continuous improvement in GPU and ASIC performance, the pace of chip design iteration is accelerating, and the adoption of advanced processes is becoming more aggressive, leading to a continued increase in demand for advanced process capacity. This also drives a simultaneous expansion in demand for reliability analysis (RA) such as chip burn-in.

Furthermore, advanced manufacturing processes will enter the 2nm node in the second half of 2025, and semiconductor technology is gradually shifting towards the new gate-all-around (GAA) architecture and chiplet heterogeneous packaging. The new defect patterns arising from process miniaturization and packaging changes present higher barriers to entry for wafer foundries and IC design companies in chip analysis and testing, thus increasing their reliance on external independent laboratories. MA (Manufacturing Analysis) is used to clarify process and material issues, and FA (Feature Analysis) is used to precisely locate the source of defects.

Among the Taiwanese companies benefiting from this, Hung Kang has long been deeply involved in MA, FA, and RA technologies, building the PHEMOS-X platform and introducing advanced analytical equipment such as transmission electron microscopy (TEM) and focused ion beam (FIB), effectively meeting the stringent verification requirements of CSPs for high-end AI chips. In recent years, the company has also actively expanded its domestic and international market presence, establishing its first and second laboratories in Nagoya, Hokkaido, and Kumamoto, in addition to Taiwan, which is expected to continue contributing to revenue growth.

iST has introduced two new technology services: a "2nm ALD (Atomic Layer Deposition) New Material Verification Platform" and a "Silicon Photonics and CPO Verification Solution." The former is a new service launched to address the development of advanced manufacturing processes. As major wafer foundries gradually adopt 3D transistor architectures, the demand for ALD equipment and new materials will expand rapidly, driving overall supply chain growth. The latter targets the optoelectronic integration needs in high-speed computing and AI server fields.

iST previously stated that due to the high initial investment in equipment and R&D for these two new businesses, they are expected to start contributing to revenue and profit from 2026 onwards. Its subsidiary, iTech Technologies, is also making steady progress in the thinning of AI power components, with major power component customers passing rigorous verification by various AI server end-users and achieving stable mass production. Analysts estimate that the company's revenue this year is expected to reach a record high, possessing the potential to earn its share capital.

Fanquan focuses on materials analysis and fault analysis. In the silicon photonics sector, the company has built a complete "silicon photonics testing and optical loss breakpoint location analysis service," covering multi-level applications from wafer-level and co-packaged optics (CPO) packaging to fiber optic component interfaces. It has obtained invention patents in Taiwan and Japan, and patent applications are ongoing in Europe, the United States, South Korea, and China. Chairman Liu Jilun previously anticipated that the company's revenue, gross margin, and profit in 2026 would be better than in 2025.

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Creating Nano Technologies, Inc.
59 Alley 21 Lane 279, Chung Cheng Road, Yung Kang City, Tainan, TAIWAN
TEL:886-6-2323927 FAX:886-6-2013306 URL: http://www.creating-nanotech.com

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