TSMC significantly increases CoWoS advanced packaging production capacity to quadruple by 2026
TechNewsTechnology News
November 27, 2024
Author Atkinson
November 27, 2024
Author Atkinson
In response to the strong market demand for 2/3 nanometer node process technology, TSMC, the leader in wafer foundry, is accelerating the production capacity improvement of global advanced process technology. At the same time, CoWoS advanced packaging capacity, which is already very tight, may continue to become one of the key constraints on the supply chain, so TSMC is also planning new production plans.
According to a report by foreign media Wccftech, TSMC's CoWoS advanced packaging plays a key role in the development of AI chips. This is also the main reason why CoWoS packaging production capacity has become in short supply after Huida's data center GPU shipments began to increase. . Since Huida's new generation product portfolio using the Blackwell architecture is about to begin shipping, CoWoS packaging production may once again encounter production bottlenecks after the huge market demand begins to engulf the entire supply chain.
According to the report, since no other supplier can fully replicate the CoWoS advanced packaging technology, various IC design companies have no choice but to wait for TSMC to allocate production capacity. Therefore, while TSMC's current CoWoS advanced packaging production capacity is approximately 36,000 wafers per month, plans have been made to increase production capacity to approximately 90,000 wafers by the end of 2025.
However, due to the surge in market demand, TSMC chose to continue to expand new equipment this quarter, with the goal of further increasing its CoWoS advanced packaging production capacity to 130,000 pieces per month by 2026. This means that in about a year, the production capacity of CoWoS advanced packaging will increase to four times.
The report emphasized that in addition to efforts to increase production capacity, TSMC also intends to continue to increase the quotation of CoWoS advanced packaging. Industry insiders have previously said that because TSMC can provide one-stop services from advanced process technology production to advanced packaging, and there are no competitors in the current market, it will be difficult for customers who are not easy to transfer orders to face price increases. No.
Related links: https://technews.tw/2024/11/27/tsmc-significantly-increases-cowos-advanced-packaging-capacity/
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