Semiconductor Expo sets record; experts: Heterogeneous integration and silicon photonics trends take shape

2025/10/03

TechNews Technology News
September 22, 2025
By Zhang Jianzhong, Central News Agency

SEMICON Taiwan, the international semiconductor exhibition, concluded successfully, achieving record-breaking attendance and visitor numbers. Industry experts say that this year's focus on heterogeneous integration and silicon photonics is expected to continue to be a key trend in the semiconductor industry.

According to statistics from the Semiconductor Industry Association (SEMI), SEMICON Taiwan, held from September 10th to 12th, attracted over 1,200 companies from 65 countries, over 4,100 booths, and 17 national pavilions, attracting 100,000 visitors, setting new record highs in both exhibition scale and visitor numbers.

SEMI noted that next year's SEMICON Taiwan is scheduled to be held from September 2nd to 4th, 2026. Preliminary estimates indicate that 95% of exhibitors have renewed their participation next year, suggesting that the exhibition scale is expected to reach a new high.

Liu Peizhen, Director of the Taiwan Institute of Economic Research's Industrial Economic Database, stated that this year's Semiconductor Expo focused on semiconductor technology innovation and industry chain integration driven by artificial intelligence (AI). From advanced processes and packaging technologies to smart manufacturing and talent development, the event showcased Taiwan's pivotal position in the global semiconductor industry and charted a future blueprint for the industry ecosystem.

Liu Peizhen stated that heterogeneous integration was a key focus of the Semiconductor Expo. To create more powerful and energy-efficient AI chips, integrating chips with different processes and functions, such as logic, memory, and sensors, into a single package has become a goal of the semiconductor industry.

Liu Peizhen pointed out that traditional electrical signal transmission is no longer able to meet the massive data throughput demands of AI, and silicon photonics will be a key technology to break through the data transmission bottleneck. Heterogeneous integration and silicon photonics will become core strategies for the AI-driven semiconductor industry. Taiwan, with its leading advantages in advanced processes and packaging, will continue to play a pivotal role.

Analyst Wang Zhaoli stated that the Semiconductor Expo serves as a bellwether for semiconductor technology, and that heterogeneous integration and other equipment will be a key focus of Taiwanese manufacturers' displays. Heterogeneous integration allows for the integration of chips with different manufacturing processes, materials, and functions within a single package, and is key to accelerating system-level innovation.

Wang Zhaoli stated that silicon photonics and co-packaged optics (CPO) are key breakthroughs in data transmission. As AI models scale, the demand for high-speed optical communications is rapidly growing, and their importance continues to increase.

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