Silicon Photonics and CPO: A New Opportunity – Touch Taiwan 2026 Launches its First “Silicon Photonics Zone”

2026/03/20

TechNews Report
March 13, 2026
Author: Chen Guanrong

The booming AI market is driving increased demand for infrastructure. This year, the Touch Taiwan series has added a "Silicon Photonics Zone" for the first time, showcasing the latest applications of silicon photonics and CPO (Co-Packaged Optics) in high-speed optical interconnects and AI data center architectures.

Through optical signal transmission, silicon photonics integration, and advanced packaging technologies, the distance between chips and optical communications can be shortened, speeds increased, and energy consumption reduced, representing a significant breakthrough for AI data centers and high-speed computing architectures. The panel industry's long-term accumulation of expertise in large-size substrate manufacturing processes, optical materials, and precision manufacturing capabilities also provides new development opportunities for the optoelectronic integration of silicon photonics and CPO.

Furthermore, as silicon photonics technology gradually moves towards mass production, the demand for high-precision process equipment, packaging equipment, and testing equipment continues to rise. Equipment manufacturers' technological investments in optical coupling, advanced packaging, and automated production equipment are becoming crucial drivers for the development of the silicon photonics industry.

To promote the development of the silicon photonics industry chain, the Touch Taiwan series of exhibitions actively promotes related technology exchange and industry cooperation. This year, a new "Silicon Photonics Zone" has been added for the first time, bringing together manufacturers from silicon photonics design, optical communication modules, advanced packaging, semiconductor equipment, and key materials industries. This zone showcases the latest achievements of silicon photonics and CPO in high-speed optical interconnects and AI data center architecture, creating an important platform for cross-industry cooperation and technology exchange.

During the exhibition, several international silicon photonics forums will be held, inviting experts from leading international companies including AMD, Fiberhome Technologies, XFPlast, Rayleigh OLED, ALLOS, ASE Technology Holding, Resonac, Dingyuan Optoelectronics, CEA-Leti, Keysight Technologies Taiwan, Komtech Optoelectronics, Dexerials, SPIL Precision Industries, Wanrun Technology, and related research institutions to discuss in depth the development trends and industrial applications of silicon photonics and CPO.

The forum covers key topics including the market development and technological evolution of silicon photonics and CPO, high-efficiency optical coupling and optoelectronic integration design, heterogeneous integration technology of Photonics and CMOS, advanced packaging architecture of CPO, and challenges in silicon photonics mass production and equipment automation. It also extends its discussion to key technological routes for high-speed optical interconnects in the AI era, including ultra-high-speed, low-power optical communication solutions ushering in a new era of data communication with Micro LED, and a comparison and application development of VCSELs and silicon photonics in AI data center optical interconnect architectures. From light source technology and module design to system integration, the forum provides a comprehensive analysis of next-generation high-speed optical communication solutions.

The Touch Taiwan series of exhibitions will be held from April 8th to 10th at Taipei Nangang Exhibition Center Hall 1, aiming to integrate industry, academia, and research resources, promote the formation of a silicon photonics industry ecosystem, and help Taiwan's panel, materials, electronic equipment, and optical communication industries seize the key development opportunities of high-speed computing and optoelectronic integration in the AI era.

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