The Ministry of Economic Affairs is building a panel-level packaging ecosystem to drive industrial transformation and seize a $2 billion market.

2026/04/14

TechNews Report

April 8, 2026
Author: Su Ziyun

The Department of Industrial Technology, Ministry of Economic Affairs, has set up an Innovation Technology Pavilion at the Touch Taiwan series of exhibitions, "Electronics Manufacturing Equipment Exhibition," starting today (April 8), showcasing 14 key technologies focusing on advanced packaging and compound semiconductors. Among them, the Industrial Technology Research Institute's (ITRI) "Next-Generation Panel-Level Packaging Metallization Technology" has been implemented in the industry, successfully reducing process costs by approximately 30%.

Zhou Chongbin, Deputy Director of the Department of Industrial Technology, stated that with the rapid growth in demand for AI, high-performance computing (HPC), and smart manufacturing, the global semiconductor industry continues to expand. According to Global Information (GII) estimates, the output value of panel-level packaging will grow from US$400 million in 2025 to US$2 billion in 2030, indicating that new packaging technologies are rapidly gaining traction.

In terms of industrial applications, this metallization technology has partnered with companies such as TPK Holding, Lianze Technology, SuperTech International, and Astrotec Precision Technology to promote the development of domestic materials and equipment supply chains and gradually build a panel-level packaging industry ecosystem.

This exhibition also highlights three technological achievements. First, the panel-level packaging metallization technology developed by ITRI (Industrial Technology Research Institute) breaks through the limitations of glass-through-via (TGV) copper filling and ceramic coating, replacing traditional methods with a fully wet coating process. This improves the coating discontinuity problem under high aspect ratio structures, enhancing process stability while effectively reducing equipment and costs.

Second, the "Wafer-based Plasma Sensing System" integrates 19 micro-sensors and intelligent algorithms on a 12-inch wafer, enabling uninterrupted real-time monitoring of the production line and accurately controlling plasma uniformity. This increases measurement efficiency by up to 10 times, and has already been verified in collaboration with equipment manufacturer TechDing.

Third, the "Low Vapor Pressure Precursor Vaporization Supply System" developed by the Metal Industries Research & Development Centre (MIRDC) can stably deliver coating gases, establishing a high aspect ratio (20:1) etch-resistant thin film process. This not only improves process yield by 2% to 3% but also reduces equipment maintenance costs, saving approximately NT$1 million per unit per year. It has already attracted investment from Dajia Yonghe Machinery in its development.

The Department of Industrial Technology stated that it will continue to deepen the R&D of semiconductor equipment and key module technologies through technology projects and the A+ Enterprise Innovation R&D Program. Furthermore, through industry-academia collaboration, it will assist domestic companies in overcoming technological bottlenecks and entering high-value-added supply chains, further strengthening Taiwan's competitiveness in the global advanced manufacturing sector.

Image Source: ITRI

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