Chinese Companies Step Up Push into Glass-Substrate Advanced Packaging as Taiwan’s Supply Chain Gears Up

2026/07/28

Economic Daily News

July 28, 2026

CNA Reporter Chung Jung-feng

China-based Lens Technology plans to collaborate with Intel on advanced packaging using glass core substrates, while BOE is aggressively developing complete production lines for glass carrier and glass core substrate packaging. Facing growing competition, Taiwan’s supply chain is integrating key semiconductor, optoelectronics, and equipment manufacturing processes in an effort to accelerate mass production.

Lens Technology previously announced that its wholly owned subsidiary, Lens International (Hong Kong), had signed a memorandum of understanding with Intel. The two companies will explore potential collaboration on through-glass via (TGV) advanced packaging technologies, including via formation in glass substrates, high-precision laser processing, via metallization, and multilayer interconnect routing. Intel will provide illustrative architectural information, design-for-manufacturability (DFM) guidelines, benchmarking procedures, and validation methodologies.

Lens Technology said the two companies will also explore potential cooperation in other areas, including structural components and modules for AI PCs, structural and thermal management components for data center servers, humanoid intelligent robots, smart industrial equipment, and edge-computing hardware.

According to an analysis by a U.S.-based institutional investor, the partnership between Lens Technology and Intel focuses on advanced packaging using glass core substrates, with mass-production shipments potentially beginning as early as the second half of 2027.

In addition to Lens Technology, BOE is actively developing advanced packaging technologies for glass carriers and glass core substrates. According to available information, BOE invested in a pilot production line for glass carrier and glass core substrate packaging in 2024 and implemented a fully automated equipment line in the first half of this year. Industry analysts noted that BOE is working with chip-design customers in China and North America to develop end-to-end process solutions, with mass production potentially beginning as early as 2028.

Taiwan’s semiconductor supply chain is also actively developing glass core substrate technologies for advanced packaging. At its investor conference in mid-July, foundry leader TSMC said it was collaborating with substrate suppliers to establish the necessary manufacturing processes. The company estimates that the processes will take approximately one year to mature before entering mass production.

Innolux and AUO continue to develop fan-out panel-level packaging (FOPLP) using rectangular glass substrates originally designed for display panels. Innolux said it had made early investments in advanced packaging and TGV technologies. In addition, TPK-KY has established a pilot production line for TGV advanced-packaging glass carriers at its Taiwan facility. Powertech Technology’s chip-last FOPLP technology can also integrate redistribution layers (RDLs) on glass substrates.

TrendForce previously stated that this year represents a critical validation period for equipment and material suppliers involved in TSMC’s Chip-on-Panel-on-Substrate (CoPoS) advanced-packaging platform. Pilot production is expected to begin in 2027, followed by commercial mass production in the second half of 2028. Development is then expected to shift toward glass core substrates, with mass production projected to begin after 2030.

Industry participants noted that glass carriers will be used in the CoPoS packaging process. The maturity of through-glass via processing for future glass core substrates will therefore directly affect substrate performance and the mass-production yield of CoPoS packaging.

Taiwanese semiconductor equipment manufacturers are actively developing key processes for glass-substrate advanced packaging. For example, Innostar Service is developing copper-pillar through-glass via substrate module products, known as TGV-ICP modules. Eclat Forever Machinery, a supplier of high-end wet-process equipment for ABF substrates, is developing glass-substrate and TGV process equipment.

Contrel Technology is also working with its subsidiary F.S.E Corporation to target laser processes and glass-carrier applications, including TGV and redistribution-layer technologies. Hui Sheng Technology is developing glass etching and surface-treatment solutions, while E&R Engineering is expanding its portfolio of TGV laser-processing equipment.

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