LP Treatment Series
In-line Plasma Cleaner
Production Description
◆Patented Electrodes: High plasma density, low ion energy, minimal component damage
◆Optimized Gas Flow: Ensures uniform and efficient processing
◆Fluid Cooling System: Stable temperature control
◆Modular Design: Flexible expansion, low maintenance cost
◆Easy Maintenance: Durable and reliable, reduces overall cost
◆Adjustable Conveyor: Quick customization for different needs
◆Versatile Operation: Supports semi-automatic and fully automatic modes with intuitive interface
◆Optimized Gas Flow: Ensures uniform and efficient processing
◆Fluid Cooling System: Stable temperature control
◆Modular Design: Flexible expansion, low maintenance cost
◆Easy Maintenance: Durable and reliable, reduces overall cost
◆Adjustable Conveyor: Quick customization for different needs
◆Versatile Operation: Supports semi-automatic and fully automatic modes with intuitive interface
Product Features
- Applicable Processes: Advanced packaging, CoWoS, IC & LED packaging
- Plasma Functions: Surface cleaning and modification
- Pre-Packaging Treatment: Die attach, wire bonding, underfill, adhesive bonding
- Compatible Products: Flip-Chip, Underfill, BGA, Lead Frame
- Additional Functions: Photoresist residue removal, organic contaminant decomposition, enhances surface hydrophilicity and adhesion