TSMC's advanced technology: panel-level packaging is under development

2025/04/25

Business Times
April 18, 2025
Author: Zhang Jiarui, Commercial Times

TSMC continues to advance in advanced process and advanced packaging technology. Chairman Wei Zhejia pointed out on the 17th that TSMC is actively developing panel level packaging technology. It is still in the study stage and it is not certain whether it will establish a production line in the United States or Taiwan.

According to the supply chain, TSMC intends to first establish mini-Line in Longtan AP5 in Taiwan, and will start with the 310x310 size, and then move to larger sizes depending on the yield.

Customers continue to use TSMC's advanced process technology and are increasingly adopting advanced packaging. Wei Zhejia said that the demand for CoWoS is gradually improving, but it is still fully loaded. TSMC needs to significantly expand production to meet customer demand. It is estimated that CoWoS production capacity will double this year. For 2026, demand will remain strong, but the situation will be more balanced.

As upstream demand and TSMC's supply are gradually becoming balanced, institutional analysts are vaguely feeling the impact of tariffs, which is gradually changing the optimistic expectations of chipmakers. TSMC's second-quarter financial forecast in US dollars showed a strong quarterly growth trend, while its full-year operating guidance maintained its previous forecast, implying that third-quarter demand would be met in advance.

However, TSMC maintains its technological leadership and resists macro-environmental risks with its mass production advantages and cutting-edge technology. Among them, panel-level packaging is regarded as the next CoWoS, and Wei Zhejia revealed that it is in the research and development stage. It will not be established in the United States as rumored by the outside world, but will be first established in Taiwan and then replicated in the United States after being confirmed to be feasible.

The supply chain pointed out that they originally intended to develop a larger size of 515x510 mm, but due to many technical obstacles that needed to be overcome, the size has been anchored at 300x300 mm, and will move towards larger sizes after improving the yield in the future. Currently, equipment manufacturers have begun to cooperate with TSMC in machine development. The industry has revealed that a "miniline" will be built in Longtan AP5 early next year and is expected to be gradually expanded in 2027.

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