Scientech Subsidiary Challentech Partners with Seiki Semiconductor to Advance the Localization of Core Equipment

2026/08/12

MoneyDJ News
August 12, 2026
By Wang Yi-ru

Scientech Corporation (3131) announced on August 11 that its subsidiary, Challentech, has entered into a partnership with Japan-based Seiki Semiconductor Co., Ltd. Challentech will officially represent Seiki Semiconductor’s full range of advanced bonding and precision surface treatment equipment.

By combining Seiki Semiconductor’s core technologies with Scientech’s equipment manufacturing, wet-process engineering, system integration, and supply chain capabilities in Taiwan, the partnership aims to accelerate the localization of critical equipment and process technologies.

One of Seiki Semiconductor’s core technologies is Surface Activated Bonding (SAB), which originated from the long-term research of Professor Tadatomo Suga of the University of Tokyo. Compared with conventional bonding methods, SAB activates and bonds material surfaces in a vacuum environment. This enables high-quality bonding while the surfaces remain highly clean and activated, even at low or near-room temperatures, thereby reducing thermal stress caused by differences in the coefficients of thermal expansion between dissimilar materials.

SAB applications extend beyond Wafer-to-Wafer (W2W) and heterogeneous material bonding. The technology also has the potential to support emerging applications such as high-performance thermal management, backside power delivery, and the integration of highly thermally conductive materials.

As the computing density and power consumption of AI chips continue to rise, simultaneously addressing computing performance, heat dissipation, and energy efficiency has become a key challenge in advanced packaging. SAB’s low-temperature bonding and heterogeneous material integration capabilities give it considerable potential in future high-performance cooling and advanced material integration applications.

In addition to SAB, Seiki Semiconductor is developing hybrid bonding and Fast Super-Atom Beam (FSB) surface treatment technologies. Before hybrid bonding, wafer or chip surfaces undergo highly precise cleaning, planarization, and surface treatment, followed by precision bonding of dielectric materials and metal interfaces. This process can support both W2W and Chip-to-Wafer (C2W) architectures and can be applied to advanced packaging technologies such as 2.5D ICs, 3D ICs, chiplets, and backside power delivery.

Scientech stated that the partnership represents more than an equipment distribution agreement. It is also an important step in the group’s expansion into critical advanced packaging processes and its effort to strengthen Taiwan’s bonding equipment manufacturing capabilities.

Taiwan already has a strong foundation in advanced packaging manufacturing and supply chains, with increasing domestic capabilities in cleaning, bonding, molding, and dispensing processes. However, critical equipment for high-end chip stacking and hybrid bonding still relies considerably on overseas suppliers.

Scientech further explained that, during the first phase of the partnership, Challentech will serve as Seiki Semiconductor’s sales representative and service contact in Taiwan. It will gradually establish capabilities in equipment sales, application engineering, process validation, customized integration, and after-sales service.

Building on this foundation, the two companies will continue exploring broader and deeper forms of cooperation. Through technical exchanges, resource integration, equipment manufacturing, application development, and market expansion, they aim to further strengthen their collaboration in advanced packaging.

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