Plasma cleaner

Creating Nano PC03/PC04 low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.

High-Efficiency Continuous Processing, Setting a New Standard for Clean Manufacturing Specifically designed for pre-treatment of various substrates before printing and bonding, featuring surface activation, modification, grafting, roughening, and deep cleaning. Suitable for surface preparation of electronic and optoelectronic components prior to packaging and lamination, effectively improving process yield and reliability.

Creating Low-Pressure Reactive Ion Etching (RIE) System Integrating patented electrode technology with an innovative gas flow field design, Creating’s low-pressure RIE system delivers high etching efficiency and superior process uniformity, widely applied in semiconductor, packaging, and optoelectronic industries.tronic industries.

Creating Nano PC06 low pressure plasma cleaner system can be used on all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.